Method and Structure for Self-Aligned Device Contacts

ABSTRACT

Disclosed are embodiments of a semiconductor structure with a partially selfaligned contact in lower portion of the contact is enlarged to reduce resistance without impacting device yield. Additionally, the structure optionally incorporates a thick middle-of-the-line (MOL) nitride stress film to enhance carrier mobility. Embodiments of the method of forming the structure comprise forming a sacrificial section in the intended location of the contact. This section is patterned so that it is self-aligned to the gate electrodes and only occupies space that is intended for the future contact. Dielectric layer(s) (e.g., an optional stress layer followed by an interlayer dielectric) may be deposited once the sacrificial section is in place. Conventional contact lithography is used to etch a contact hole through the dielectric layer(s) to the sacrificial section. The sacrificial section is then selectively removed to form a cavity and the contact is formed in the cavity and contact hole.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is a division of U.S. application Ser. No. 11/460,010filed Jul. 26, 2006, the complete disclosure of which, in its entirety,is herein incorporated by reference.

BACKGROUND

1. Technical Field

The present disclosure relates generally to semiconductor structuredesign and fabrication and, more particularly, to a semiconductorstructure with self-aligned device contacts and a method of forming thesemiconductor structure.

2. Description of the Related Art

As device densities within semiconductor structures increase, overlaytolerances between contact (e.g., source/drain contact) and gatelithography levels are difficult to achieve. As a result source/draincontact sizes are reduced (i.e., the contact diameter is scaled) toensure that the contacts do not short the source/drain diffusion regionto the gate electrode. In particular, reducing the contact sizes avoidsforming the contacts through the gate sidewall spacers and, thereby,contacting unsilicided active silicon (e.g., a source/drain extension)and severely degrading external resistance. However, scaling the contactsize substantially increases the resistance of the contact. Therefore,there is a need in the art for a semiconductor structure with a devicecontact that provides optimal resistance without impacting device yield.

SUMMARY

In view of the foregoing, disclosed are embodiments of a semiconductorstructure having a partially self-aligned device contact that providesoptimal resistance without impacting device yield. An additionalembodiment of the structure incorporates a thick middle-of-the-line(MOL) stress layer to provide optimal carrier mobility within thedevice. Also, disclosed are embodiments of a method of forming thestructure.

Each embodiment of the semiconductor structure of the present disclosurecomprises two parallel gate electrodes (i.e., gate electrode lines) on asemiconductor substrate, sidewall spacers adjacent to the gateelectrodes, a silicide region on the semiconductor substrate between thegate electrodes and at least one dielectric layer over the gateelectrodes.

A contact connects to the silicide region through the dielectriclayer(s). This contact comprises a self-aligned lower portion and anupper portion. In particular, the lower portion extends between andfollows the contours of the sidewall spacers that are adjacent to thegate electrodes in order to maximize the contact area between thecontact and the silicide region. The upper portion of the contactextends through the dielectric layer(s) to the lower portion. This upperportion is narrower than the lower portion, and particularly, narrowerthan the top surface of the lower portion.

The sidewall spacers are positioned adjacent to each of the gateelectrodes in order to isolate the contact from the gate electrodes.These sidewall spacers may be tapered towards the top of the electrodes.Such tapered sidewall spacers allow the top surface of the self-alignedlower portion of the contact to be formed wider than the bottom surface.

In each embodiment of the present disclosure the upper portion of thecontact extends through at least one dielectric layer to the lowerportion. For example, in one embodiment the structure can comprise asingle dielectric layer above the gate electrodes and the lower portionof the contact. In another embodiment, the structure can comprise both adielectric stress layer above the gate electrodes and the lower portionof the contact and another dielectric layer above the stress layer.Thus, in this particular embodiment, the upper portion of the contactextends through both the dielectric layer and the dielectric stresslayer to the lower portion. This stress layer can comprise a compressivenitride layer, a tensile nitride layer, or a dual-strain nitride layerand is used to optimize carrier mobility within devices (e.g.,transistors).

Embodiments of the method of forming the semiconductor structuresdescribed above comprise first forming at least two gate electrodes(i.e., gate electrode lines) separated by a gap on a semiconductorsubstrate. Sidewall spacers (e.g., oxide and/or nitride sidewallspacers) are formed adjacent to the gate electrodes. Particularly,tapered sidewall spacers may be formed so that the lower portion of thecontact, which is subsequently formed between these sidewall spacersusing a self-aligned process (see discussion below), will be formed witha wider top surface than bottom surface. A silicide region is thenformed on the semiconductor substrate in the gap between the gateelectrodes. In particular, the silicide region is formed (e.g., usingconventional silicide formation processes) on the exposed portion of thesemiconductor substrate that extends between the sidewall spacers thatare adjacent to each of the gate electrodes.

Once the silicide region is formed, a sacrificial section is formedadjacent to the sidewall spacers in the gap between the gate electrodesin the desired location for the contact. This sacrificial section may beformed by filling the gap between the electrodes with a sacrificialmaterial that has a very high etch selectivity to the materials used toform the spacers and the subsequently formed dielectric layer(s). Forexample, the sacrificial material may be a low-k constant (i.e., k<3)dielectric material (e.g., SiLK™) that has a very high etch selectivityto nitrides and/or oxides. The sacrificial material may be deposited,spun-on, etc. The sacrificial material may be self-planarizing or may beplanarized and/or recessed so that that the top surface of thesacrificial material is level with or below the top of the gateelectrodes. Once the gap is filled, the sacrificial material ispatterned (e.g., lithographically patterned) in order to form thesacrificial section in the location of the semiconductor structure wherethe contact is to be positioned. This sacrificial material isparticularly patterned so that the sacrificial section extends betweenthe sidewall spacers and is perpendicular to the gate electrodes and sothat portions of the semiconductor substrate on either side of thesacrificial section are exposed.

After the sacrificial material is patterned to form the sacrificialsection, at least one dielectric layer is formed over the gateelectrodes, the sacrificial section and the exposed portions of thesemiconductor substrate. In particular, in one embodiment a singledielectric layer is formed over the gate electrodes, the sacrificialsection and the exposed portions of the semiconductor substrate. Inanother embodiment, an optional dielectric stress layer is formed overthe gate electrodes, the sacrificial section and the exposed portions ofthe semiconductor substrate and, then, another dielectric layer isformed over the optional dielectric stress layer. Forming the optionaldielectric stress layer may be accomplished using known techniques toform a compressive nitride layer, a tensile nitride layer, or adual-strain nitride layer in order to optimize carrier mobility forparticular devices in the semiconductor substrate.

After forming the dielectric layer(s), a contact hole is patterned(e.g., using conventional contact lithography) and etched (e.g., by areactive ion etching (RIE) process) through the dielectric layer(s) tothe top surface of the sacrificial section. The contact hole may beparticularly patterned so that it is narrower than the sacrificialsection. Thus, the sacrificial section creates a landing pad for thecontact hole etch process that is wider than the contact hole andthereby provides a greater tolerance for over etching. If multipledielectric layers (e.g., a dielectric stress layer and anotherdielectric layer) were previously formed, this etching process mayrequire multiple stages designed to selectively etch each of thedielectric layers.

Once the top surface of the sacrificial section is exposed, thesacrificial section is selectively removed to form a cavity and exposethe silicide region without removing or damaging the surroundingdielectrics (e.g., the dielectric materials used to form the sidewallspacers and the dielectric layer(s). For example, if SiLK™ is used toform the sacrificial section, the sacrificial section may be ashed outusing a selective plasma etch process.

Once the silicide region is exposed, the contact is formed by forming anoptional conductive contact liner (e.g., a titanium nitride liner)against the outer surfaces of the cavity and against the sidewalls ofthe contact hole. Then, a conductive fill material (e.g., a metal, suchas tungsten or copper) is deposited through the contact hole until thecavity and contact hole are filled. Thus, a lower self-aligned portionof the contact is formed on the silicide region between sidewall spacersthat are adjacent to each of the gate electrodes and an upper portion isformed within the contact hole above the lower portion.

These, and other, aspects and objects of the present disclosure will bebetter appreciated and understood when considered in conjunction withthe following description and the accompanying drawings. It should beunderstood, however, that the following description, while indicatingembodiments of the present disclosure and numerous specific detailsthereof, is given by way of illustration and not of limitation. Manychanges and modifications may be made within the scope of the presentdisclosure without departing from the spirit thereof.

BRIEF DESCRIPTION OF THE DRAWINGS

The disclosure will be better understood from the following detaileddescription with reference to the drawings, in which:

FIG. 1 is a schematic diagram illustrating a cross-sectional view of asemiconductor structure having potential contact profiles achievableusing conventional contact lithography, in accordance with oneembodiment of the present disclosure;

FIG. 2 is a schematic diagram similar to FIG. 1 illustrating across-sectional view of the embodiment of the semiconductor structure ofFIG. 1;

FIG. 3 is a flow diagram illustrating an embodiment of a method offorming a semiconductor structure in accordance with the presentdisclosure;

FIGS. 4 and 5 are schematic diagrams illustrating a cross-sectional viewof a partially completed semiconductor structures of the presentdisclosure;

FIG. 6; is a top view of the partially completed structure of FIGS. 4and 5;

FIG. 7 is a schematic diagram illustrating a cross-sectional view takenalong section line A of FIG. 6;

FIG. 8 is a schematic diagram illustrating a cross-sectional view takenalong section line B of FIG. 6; and

FIGS. 9-12 are schematic diagrams illustrating a cross-sectional view ofa partially completed structure of the present disclosure.

DETAILED DESCRIPTION OF PREFERRED EMBODIMENTS

The present disclosure and the various features and advantageous detailsthereof are explained more fully with reference to the nonlimitingembodiments that are illustrated in the accompanying drawings anddetailed in the following description. It should be noted that thefeatures illustrated in the drawings are not necessarily drawn to scale.Descriptions of wellknown components and processing techniques areomitted so as to not unnecessarily obscure the present disclosure. Theexamples used herein are intended merely to facilitate an understandingof ways in which the present disclosure may be practiced and to furtherenable those of skill in the art to practice the present disclosure.Accordingly, the examples should not be construed as limiting the scopeof the present disclosure.

Referring to FIG. 1, a semiconductor structure of the present disclosureis illustrated and is designated generally as structure 100. As devicedensities within semiconductor structure 100 increase, overlaytolerances between contact (e.g., source/drain contact 180) and gate111-112 lithography levels are difficult to achieve. In particular, whenusing conventional contact lithography there is a margin of error in theplacement of the contact hole 180 a directly above the silicide region140. When the contact hole is etched (e.g., by using a reactive ionetching (RIE) process), lack of selectivity in the RIE process incombination with this margin of error, may cause the contact hole topunch through the dielectric spacers 121 or 122 on either side of thesilicide region 140 (e.g., see potential contact profiles 180 b and 180c). Consequently, when the contact is formed it may contact unsilicidedactive silicon in a substrate 105 and, thereby, degrade deviceperformance. In order to compensate for this margin of error and lack ofselectivity in the RIE process, source/drain contact sizes are oftenreduced (i.e., the contact diameter is scaled) so as to ensure that thecontacts do not short the source/drain diffusion region to the gateelectrode 111, 112. However, scaling the contact size substantiallydecreases the contact area between the contact and the silicide regionand increases the resistance of the contact. Therefore, there is a needin the art for a semiconductor structure with a device contact thatprovides optimal resistance without impacting device yield.

In view of the foregoing, embodiments of a semiconductor structure aredisclosed having a partially self-aligned device contact in which thebottom diameter of the contact is significantly enlarged to maximize thecontact area between the contact and the silicide region and to minimizecontact resistance. Since the contact is self-aligned to gateelectrodes, the size expansion does not intrinsically impact deviceyield. Additionally, an embodiment of the present disclosure also allowsfor the integration of a thick middle-of-the-line (MOL) nitride stressfilm to enhance carrier mobility in the devices within the semiconductorstructure. Embodiments of the method of forming the structure of thepresent disclosure comprise forming a sacrificial section (i.e., adisposable plug) in the intended location of the contact. This plug ispatterned so that it is self-aligned to the gate electrodes and onlyoccupies space that is intended for the future contact. Dielectriclayer(s) (e.g., an optional nitride stress layer followed by aninterlayer dielectric) may be deposited once the plug is in place.Conventional contact lithography is used to etch a contact hole throughthe dielectric layer(s) to the sacrificial section. The sacrificialsection is, then, selectively removed and the contact is formed therein.

Referring to FIG. 2, embodiments of a semiconductor structure 200 of thepresent disclosure is illustrated and comprises at least two parallelgate electrodes 211, 212 (i.e., parallel gate electrode lines) on asemiconductor substrate 205 (e.g., a bulk wafer, an SOI wafer, etc.),sidewall spacers 221, 222 adjacent to each of the gate electrodes 211,212, a silicide region 240 on the semiconductor substrate 205 betweenthe gate electrodes 211, 212 and at least one dielectric layer 251, 252over the gate electrodes 211, 212.

In one embodiment, the parallel gate electrodes 211, 212 and thesemiconductor substrate 205 may be designed and configured to formmultiple transistors for dense multitransistor devices, such as, forexample, static random access memory (SRAM) cells, complementary metaloxide semiconductor (CMOS) devices, or similar devices that have aminimum contacted pitch.

With continued reference to FIG. 2, a contact 280 connects to thesilicide region 240 through the dielectric layer(s) 252, 251. Thiscontact 280 comprises a lower portion 281 and an upper portion 282. Thelower portion 281 is below the dielectric layer(s) 251, 252 and has abottom surface 284 that is adjacent to the silicide region 240 and a topsurface 283 that is adjacent to the upper portion 282. In addition, thelower portion 281 of the contact is selfaligned between the gateelectrodes 211, 212. In particular, the lower portion 281 extendsbetween and follows the contours 226, 227 of the sidewall spacers 221and 222, respectively, that are adjacent to the gate electrodes 211,212, respectively, so as to maximize the contact area between thecontact 280 and the silicide region 240. In one embodiment, the lowerportion 281 and particularly, the bottom surface 284 of the lowerportion 281 may be formed such that it is wider than the gate electrodes211, 212.

The upper portion 282 of the contact 280 extends through the dielectriclayer(s) 251, 252 to the lower portion 281 and is narrower than thelower portion 281. In particular, the bottom surface of the upperportion 282 is narrower than the adjacent top surface 283 of the lowerportion 281. In one embodiment, the upper portion 282 may be centereddirectly above the lower portion 281 and the silicide region 240, asillustrated in contact hole profile 280 a. Alternatively, due to theseparate processes used to form the lower and upper portions 281, 282(described below) which result in the upper portion 282 being narrowerthan the lower portion 281, the upper portion 282 may be offset slightlyto either side (e.g., see the contact hole profiles 280 b and 280 c)without significantly impacting device performance.

With continued reference to FIG. 2, the sidewall spacers 221, 222 of thestructure 200 are positioned adjacent to each of the gate electrodes211, 212, respectively, in order to isolate the contact 280 from thegate electrodes 211, 212. These sidewall spacers may be multi-layeredand can comprise a variety of dielectric materials, such as, forexample, oxides, nitrides, low-k dielectrics, etc. Additionally, thesidewall spacers 221, 222 may also be tapered such that they are widertowards the bottom of the gate electrodes 211, 212 and narrower towardsthe top. Such tapered sidewall spacers allow the top surface 283 of theself-aligned lower portion 281 of the contact 280 to be formed widerthan the bottom surface 284.

As described hereinabove, in each embodiment of the present disclosurethe upper portion 282 of the contact 280 extends through at least onedielectric layer to the lower portion 281. For example, in oneembodiment of the present disclosure the structure 200 can comprise asingle dielectric layer (e.g., 252) above the gate electrodes 211, 212and the lower portion 281 of the contact 280. In another embodiment ofthe present disclosure the structure 200 can comprise a dielectricstress layer 251 above the gate electrodes 211, 212 and the lowerportion 281 of the contact 280 as well as another dielectric layer 252above the stress layer 251.

The stress layer 251 can comprise a compressive nitride layer, a tensilenitride layer, or a dual-strain nitride layer and is used to optimizecarrier mobility within the semiconductor structure devices (e.g.,within the transistors comprising the gate electrodes 211, 212).Particularly, mechanical stress control of the channel regions may beused to enhance hole mobility in p-type MOSTFETs (p-FETs) and electronmobility n-type MOSFETs (n-FETs). For example, a compressive film over ap-FET structure enhances hole mobility to optimize p-FET performance.Alternatively, a tensile film over an n-FET structure enhances electronmobility to optimize n-FET performance. A dual-strain nitride layer is anitride layer that has both tensile strain regions and compressivestrain regions in order to simultaneously enhance carrier mobility inthe channel regions of both n-FETs and p-FETs, respectively, on the samewafer.

With reference to FIGS. 3-6, a method of forming a semiconductorstructure in accordance with the present disclosure will now bediscussed in detail. The embodiments of the method of forming thesemiconductor structures, described above, comprise completing the frontend of the line (FEOL) processing (302). Particularly, during the FEOLprocessing at least two parallel gate electrodes 211, 212 (i.e., gateelectrode lines) are formed separated by a gap 213 on semiconductorsubstrate 205 (304), as illustrated in FIG. 4. In addition, sidewallspacers 221, 222 (e.g., oxide and/or nitride sidewall spacers) areformed adjacent to the gate electrodes 211, 212, respectively (306), asillustrated in FIG. 4. In particular, and as described herein below,tapered sidewall spacers may be formed so that the lower portion 281 ofthe contact 280, which is subsequently formed between these sidewallspacers 221, 222 using a self-aligned process, will be formed with awider top surface 283 than bottom surface 284 (308). See FIG. 2.Additional FEOL processing can include, but is not limited to, dopingthe source/drain extensions, doping the source/drain diffusion regions,forming halos, etc.

With continued reference to FIGS. 3 and 4, a silicide region 240 is thenformed on the semiconductor substrate 205 in the gap 213 between thegate electrodes 211, 212 (310, see FIG. 4). In particular, the silicideregion 240 is formed (e.g., using conventional silicide formationprocesses) on the exposed portion of the semiconductor substrate 205that extends between the sidewall spacers 221 and 222 that are adjacentto each of the gate electrodes 211, 212.

With reference to FIGS. 3 and 5, once the silicide region 240 is formed(at process 310), a sacrificial section 290 (i.e., a disposable plug,self-aligned disposable mandrel, etc.) is formed adjacent to thesidewall spacers 221, 222 in the gap 213 between the gate electrodes211, 212 (312). In particular, the sacrificial section 290 is formed ata pre-selected location on the silicide region 240 where the contact 280is to be formed (i.e., at a desired contact location). This sacrificialsection 290 may be formed by filling the gap 213 between the electrodes211, 212 with a sacrificial material (314). The sacrificial materialmust comprise a material that has a very high etch selectivity to thematerials used to form the spacers 221, 222 and the subsequently formeddielectric layer(s) 251, 252 (316). For example, the sacrificialmaterial may be a low-k constant (i.e., k<3) dielectric material (e.g.,SiLK™) that has a very high etch selectivity to nitrides and/or oxides(318). The sacrificial material may be deposited, spun-on, etc. Thesacrificial material may be self-planarizing or may be planarized and/orrecessed so that that the top surface 292 of the sacrificial material islevel with or below the top 214 of the gate electrodes 211, 212.

With reference to FIGS. 3 and 6, once the gap 213 is filled (at process316), the sacrificial material is patterned (e.g., lithographicallypatterned) (320) with a line/space feature. This line/space featureforms the sacrificial section 290 in the location of the semiconductorstructure where the contact is to be positioned (322). This sacrificialmaterial is particularly patterned so that the sacrificial section 290extends within the gaps 213 between the sidewall spacers 221, 222, isperpendicular to the gate electrodes 211, 212 and is in a desiredlocation for the contact 280. Additionally, the sacrificial material ispatterned so that portions 291 of the semiconductor substrate 205 oneither side of the sacrificial section 290 are exposed (324).Consequently, the sacrificial sections 290 and thus, the contact 280locations are designed in a grid pattern.

After the sacrificial material is patterned to form the sacrificialsection 290 (at process 312), at least one dielectric layer is formedover the gate electrodes, the sacrificial section and the exposedportions of the semiconductor substrate (326-334). For example, in oneembodiment of the present disclosure a single dielectric layer 252(e.g., interlayer dielectric) is formed over the gate electrodes 211,212, the sacrificial section 290 and the exposed portions 291 of thesemiconductor substrate 205 (334). In another embodiment of the presentdisclosure, an optional dielectric stress layer 251 (i.e., a middle ofthe line (MOL) stress liner) is first formed over the gate electrodes211, 212, the sacrificial section 290 and the exposed portions 291 ofthe semiconductor substrate 205.

FIGS. 7 and 8 illustrate cross-sections A and B, respectively, of thestructure of FIG. 6 following the deposition of an optional dielectricstress layer 251 (at process 324). Particularly, FIG. 7 illustrates thestress layer 251 over the electrodes 211, 212 and the sacrificialsection 290. FIG. 8 illustrates the stress layer 251 on the electrodes211, 212 and within the gap 213 on the exposed portions 291 of thesubstrate 205 on either side of the sacrificial section 290 (not shown).Thus, the sacrificial section 290 prevents deposition of the nitridelayer 251 in the region of the semiconductor substrate 205 where thecontact is to be formed.

The optional stress layer 251 may be used to apply mechanical stress tothe channel regions of devices in the semiconductor structure (e.g.,transistors that incorporate the gate electrodes 211, 212 and thesemiconductor substrate 205) in order to enhance hole mobility in p-typeMOSTFETs (p-FETs) or electron mobility n-type MOSFETs (n-FETs). Inparticular, known techniques may be used to form a compressive nitridelayer (330), a tensile nitride layer (328) or a dual-strain nitridelayer (332). Forming a compressive film over a p-FET structure enhanceshole mobility to optimize p-FET performance. Forming a tensile film overan n-FET structure enhances electron mobility to optimize n-FETperformance. Forming a dual-strain nitride layer that has both tensilestrain regions and compressive strain regions can enhance mobility inboth n-FETs and p-FETs that are formed on the same semiconductorsubstrate. With particular reference to FIG. 9 and with continuedreference to FIG. 3, once the stress layer 251 is deposited, anotherdielectric layer 252 (e.g., an interlayer dielectric) may be formed(e.g., deposited and planarized) over the optional dielectric stresslayer 251 (334).

With reference to FIGS. 3, 10 and 11, after forming the dielectriclayer(s) (at processes 326-334), a contact hole 285 is patterned(336-338) (e.g., using conventional contact lithography) and etched(e.g., by a conventional reactive ion etching (RIE) process) through thedielectric layer(s) 251, 252 to the top surface 292 of the sacrificialsection 290 (340). The contact hole 285 may be particularly patterned sothat it is narrower than the sacrificial section 290 and particularly,narrower than the top surface 292 of the sacrificial section 290. Thus,the sacrificial section 290 creates a landing pad for the contact hole285 etch process that is wider than the contact hole and therebyprovides a greater tolerance for over etching. If multiple dielectriclayers (e.g., a dielectric stress layer 251 and another dielectric layer252) were previously formed (at process 326-334), this etching processmay require multiple stages designed to selectively etch through each ofthe dielectric layers 251, 252.

Once the top surface 292 of the sacrificial section 290 is exposed, thesacrificial section 290 is selectively removed forming a cavity 293 andexposing the silicide region 240 without removing or damaging thesurrounding dielectrics (e.g., the dielectric materials used to form thesidewall spacers 221, 222 and the dielectric layer(s) 251, 252) (342).See FIG. 12. For example, if SiLK™ is used to form the sacrificialsection 290, the sacrificial section 290 may be ashed out using aselective plasma etch process.

Once the silicide region 240 is exposed and the cavity 293 is formed,the contact 280 is formed (346-348) by forming an optional conductivecontact liner (e.g., a titanium nitride liner) against the outersurfaces 294 of the cavity 293 (i.e., the surfaces that were exposed byremoving the sacrificial section 290, such as the silicide region 240,the sidewall spacers 221, 222, etc.) and the sidewalls 286 of thecontact hole 285. Then, a conductive fill material (e.g., a metal, suchas tungsten or copper) is deposited (e.g., using a high-aspect-ratiofill or plating method) through the contact hole 285 until the cavity293 and contact hole 285 are filled. Thus, as illustrated in FIG. 2, alower self-aligned portion 281 of the contact 280 is formed betweensidewall spacers 221, 222 that are adjacent to each of the gateelectrodes 211, 212 and an upper portion 282 is formed within thecontact hole 285 above the lower portion 281 using conventional RIElithography. By self-aligning the lower portion 281 of the contact 280,this method both maximizes the contact area between the contact 280 andthe silicide region 240 so as to minimize contact resistance andeliminates the junction leakage found in typical contacts resulting fromcontact etch through the sidewall spacers adjacent to the gateelectrodes. The method also allows for line/space lithography of thelower portion 281 of the contact, thereby, increasing lithographyfidelity. Additionally, as described hereinabove, if the sidewallspacers 221, 222 are tapered, this self-aligned process ensures that thetop surface 283 of the lower portion 281 of the contact 280 is widerthan the bottom surface 284. The wider top surface 283 not onlydecreases contact resistance but also improves the RIE process marginfor the upper portion 282 of the contact since there is a larger landingpad for the etch process and thus, little, if any, over etch of the gatesidewall spacers. Following contact liner and fill deposition (atprocess 346) and contact planarization (at process 348), back end of theline (BEOL) processing continues to interconnect the active components(transistors, resistors, etc.) on the substrate with wiring, etc.

Therefore, disclosed above are embodiments of a semiconductor structurewith a partially self-aligned contact integration scheme in which thediameter of the lower portion of the contact is significantly enlargedto reduce resistance. Since the contact is self-aligned to gateelectrodes, the size expansion does not intrinsically impact deviceyield. Additionally, an embodiment of the structure allows for theintegration of a thick middle-of-the-line (MOL) nitride stress film toenhance carrier mobility. Embodiments of the method of forming thestructure comprise forming a sacrificial section (i.e., a disposableplug) in the intended location of the contact. This plug is patterned sothat it is self-aligned to the gate electrodes and only occupies spacethat is intended for the future contact. Dielectric layer(s) (e.g., anoptional stress layer followed by an interlayer dielectric) may bedeposited once the sacrificial section is in place. Conventional contactlithography is used to etch a contact hole through the dielectriclayer(s) to the sacrificial section. The sacrificial section is, then,selectively removed to form a cavity and the contact is formed in thecavity and contact hole.

While the present disclosure has been described in terms of preferredembodiments, those skilled in the art will recognize that the presentdisclosure may be practiced with modification within the spirit andscope of the appended claims.

1. A method of forming a semiconductor structure, said methodcomprising: forming at least two gate electrodes separated by a gap on asemiconductor substrate; forming sidewall spacers adjacent to said gateelectrodes; forming a silicide region on said semiconductor substratebetween said gate electrodes; forming a sacrificial section in said gapadjacent to said sidewall spacers; forming a dielectric layer over saidgate electrodes and said sacrificial section; etching a contact holethrough said dielectric layer to said sacrificial section; selectivelyremoving said sacrificial section to form a cavity and expose saidsilicide region; and depositing a conductive material into said cavityand said contact hole so as to form a contact having a lower portion onsaid silicide region between said gate electrodes and an upper portionwithin said contact hole above said lower portion.
 2. The method ofclaim 1, wherein said forming of said sacrificial section comprisesforming said sacrificial section in a preselected location on saidsilicide region where said contact is subsequently to be formed.
 3. Themethod of claim 1, wherein said forming of said sacrificial sectioncomprises: filling said gap between said gate electrodes with asacrificial material so that said sacrificial material does not extendabove said gate electrodes; and patterning said sacrificial material sothat said sacrificial section extends between said sidewall spacers andis perpendicular to said gate electrodes and so that portions of saidsemiconductor substrate are exposed adjacent to said sacrificialsection.
 4. The method of claim 1, wherein said sacrificial section isformed with a low-k dielectric material, where k is less than 3.0. 5.The method of claim 1, wherein, before said etching, patterning saidcontact hole so that said contact hole is narrower than said sacrificialsection.
 6. The method of claim 1, wherein said forming of said sidewallspacers comprises forming tapered sidewall spacers so that said lowerportion of said contact is subsequently formed with a wider top surfacethan bottom surface.
 7. A method of forming a semiconductor structure,said method comprising: forming at least two gate electrodes separatedby a gap on a semiconductor substrate; forming sidewall spacers adjacentto said gate electrodes; forming a silicide region on said semiconductorsubstrate between said gate electrodes; forming a sacrificial section insaid gap adjacent to said sidewall spacers; forming a stress layer;forming a dielectric layer on said stress layer; etching a contact holethrough dielectric layer and said stress layer to said sacrificialsection; selectively removing said sacrificial section to form a cavityand expose said silicide region; and depositing a conductive materialinto said cavity so as to form a contact having a lower portion on saidsilicide region between said gate electrodes and an upper portion withinsaid contact hole above said lower portion.
 8. The method of claim 7,wherein said forming of said sacrificial section comprises forming saidsacrificial section in a preselected location on said silicide regionwhere said contact is subsequently to be formed.
 9. The method of claim7, wherein said forming of said sacrificial section comprises: fillingsaid gap between said gate electrodes with a sacrificial material sothat said sacrificial material does not extend above said gateelectrodes; and patterning said sacrificial material so that saidsacrificial section extends between said sidewall spacers and isperpendicular to said gate electrodes and so that portions of saidsemiconductor substrate are exposed adjacent to said sacrificialsection.
 10. The method of claim 7, wherein said sacrificial section isformed with a low-k dielectric material, where k is less than 3.0. 11.The method of claim 7, wherein, before said etching, patterning saidcontact hole so that said contact hole is narrower than said sacrificialsection.
 12. The method of claim 7, wherein said forming of saidsidewall spacers comprises forming tapered sidewall spacers so that saidlower portion of said contact is subsequently formed with a wider topsurface than bottom surface.
 13. The method of claim 7, wherein saidforming of said stress layer comprises forming one of a compressivenitride layer, a tensile nitride layer, and a dual-strain nitride layer.14. A method of forming a semiconductor structure, said methodcomprising: forming at least two gate electrodes separated by a gap on asemiconductor substrate; forming sidewall spacers adjacent to said gateelectrodes; forming a silicide region on said semiconductor substratebetween said gate electrodes; forming a sacrificial section in said gapadjacent to said sidewall spacers; forming a dielectric layer over saidgate electrodes and said sacrificial section; etching a contact holethrough said dielectric layer to said sacrificial section; selectivelyremoving said sacrificial section to form a cavity and expose saidsilicide region; and depositing a conductive material into said cavityand said contact hole so as to form a contact having a lower portion onsaid silicide region between said gate electrodes and an upper portionwithin said contact hole above said lower portion.
 15. The method ofclaim 14, wherein said forming of said sacrificial section comprisesforming said sacrificial section in a preselected location on saidsilicide region where said contact is subsequently to be formed.
 16. Themethod of claim 14, wherein said forming of said sacrificial sectioncomprises: filling said gap between said gate electrodes with asacrificial material so that said sacrificial material does not extendabove said gate electrodes; and patterning said sacrificial material sothat said sacrificial section extends between said sidewall spacers andis perpendicular to said gate electrodes and so that portions of saidsemiconductor substrate are exposed adjacent to said sacrificialsection.
 17. The method of claim 14, wherein said sacrificial section isformed with a low-k dielectric material, where k is less than 3.0. 18.The method of claim 14, wherein, before said etching, patterning saidcontact hole so that said contact hole is narrower than said sacrificialsection.
 19. The method of claim 14, wherein said forming of saidsidewall spacers comprises forming tapered sidewall spacers so that saidlower portion of said contact is subsequently formed with a wider topsurface than bottom surface.